Saturday, October 1, 2016

Thermaltake Engine 27: kinetic low-profile cooling for Intel – Gadzeto Mania

cooling of the processors life and interesting innovation. The GPU provides extremely compact dimensions and a large enough performance. So if should look like the future of cooling the smaller computers?

  1. What are the dimensions of the Thermaltake Engine 27?
  2. what is the innovation of its design?
  3. What is the maximum TDP it can handle?
  4. which podstawkami CPU should be compatible?

Efficient implementation of the well-known ideas

the Idea of creating kinetycznego cooling for CPUs has been several years, but nobody has been able to implement on the basis of its product that could conquer the market. This time the attempt was made by Thermaltake with their Engine 27, and his design looks pretty promising. Cooling has dimensions of 91.5 × 91.5 × 27 mm.

High efficiency and excellent corporate culture

Design is, contrary to popular belief, is quite simple. The heat from the processor comes on a copper cooling stand and then passed in a circle from the aluminum fins. Their design was directly transferred to the layouts laptopowych.

Working inside of a circle 60 mm fan (radiator and cooling simultaneously), equipped with 40 aluminum blades, throws the air in a radius of 360° through the fins, except the cooling system. The total weight of the Engine 27 is 310 g, and the efficiency was determined at no more than 70.

Parameters used fan portend good performance in compliance with proper work culture. At rpm 1500 – 2500 rpm and air flow 9.2 CFM should be expected 13 – 25 DBA. The operation time of the fan is estimated at 50,000 hours, and the connection is made via a 4-pin power connector.

Unnecessarily limit compatibility

advantages of the Engine 27 will benefit the owners of the computers at the Intel booth 1156, 1155, 1150 or 1151. It is a pity, because a considerable part of the owners of minicomputers to build them on platforms, in particular, the APU from AMD. Compatibility, however, at this stage it is not a foregone conclusion, which gives some hope for the future.

it is also not clear itself cooling efficiency. However, the design is optimistic, however, is still unknown, in particular, the influence of hot air from the radiator directly into the memory modules and processor power. The answer to your question, of course, independent tests, but these come, wait – the cost is $ 50 already disclosed, but release date remains unknown.

Source: materials of press releases, Thermaltake


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